Your mission

The future of AI computing is light, not electrons.
At Q.ANT, we are building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor based architectures for next-generation AI and high-performance computing.
As Senior Integrated Photonics Packaging Engineer (m/f/d) in our PIC OPS team, you will drive the transition of Q.ANT’s photonic computing technology from R&D prototypes to miniaturized, high-performance photonic modules. Focusing on RF and electro-optical packaging, you will define, develop, and verify high-frequency packaging concepts that unite PICs, light sources, photodetectors, and analog circuitry. By managing global suppliers and innovating beyond existing design rules, you will create proprietary packaging architectures that form a core competitive differentiator for our technology.

Your Impact & Responsibilities

• Define and own high-density electro-optical and RF packaging solutions, ensuring superior Signal Integrity (SI) and Power Integrity (PI)
• Lead supplier - driven R&D packaging projects from technical specification and contract negotiation through to final system integration and validation
• Perform electromagnetic modeling, co-simulation of package structures, and implementation of transmission line theory and EMC shielding techniques
• Drive Design for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Build-up)
• Execute thermal management strategies for high-power photonic and
  high-frequency devices
• Establish quality assurance and verification protocols to achieve ≥95%
  first-pass qualification on supplier-delivered modules
• Implement at least one new packaging material, process, or high-frequency architecture annually to build and protect proprietary Q.ANT IP
• Collaborate closely with internal R&D, systems, manufacturing, and test teams to align RF packaging solutions with overall system architecture

Your profile

• M.Sc. or Ph.D. in Electrical Engineering, Photonics, Optoelectronics, Physics, or a related field; equivalent ndustry experience also considered
• 5+ years of hands-on experience in RF packaging, optoelectronic integration, or high-density interconnect technologies
• Proven track record of managing supplier-led R&D projects from requirement definition through to integration and validation
• Deep expertise in RF signal/power integrity, electromagnetic simulation tools, S-parameter measurements, and EMC shielding
• Solid background in semiconductor backend integration, thermal management, and advanced packaging substrates (HTCC, LTCC, HDI)
• Familiarity with CAD tools for electronic packaging, statistical process control (SPC), and industry standards (e.g., Telcordia, JEDEC)
• Solution-oriented mindset with high attention to detail, proactive ownership, strong self-leadership, and cross-functional communication skills
• Fluent in English; knowledge of German or another European language is a plus

Why us?

• Work on the leading edge: Shape deep-tech evolution by developing novel high frequency packaging architectures that push the physical boundaries of AI computing.
• Make impact at scale: Transition photonics computing from prototypes to scalable, high-yield mass production, directly accelerating our time-to-market.
• Broad decision-making authority: Enjoy wide autonomy to challenge existing design rules, define technical strategies, select suppliers, and propose new packaging technologies.
• Fast-track your growth: Solve complex high-frequency and electro-optical challenges with few industry precedents—every solution you build contributes to industry-defining IP.
• World-class team: Collaborate alongside a passionate, international team of experts in photonics, RF design, processor architecture, and AI systems.
• Direct access to leadership: Work directly with the Head of PIC, company founders, and an advisory board that has shaped the semiconductor industry.