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Process Engineering

RESPONSIBILITIES:

  • Develop and maintain deep understanding of molding materials, equipment parameters, and process controls in Transfer Molding and Post-Mold Cure stations.

  • Monitor, analyze, and improve process performance indicators such as yield, OEE, UPH, and scrap rate for molding operations.

  • Drive quality issue resolution through structured problem-solving methodologies (8D, 5 Whys, DOE, SPC).

  • Collaborate with equipment engineering and production teams to ensure alignment with product and customer specifications.

  • Actively lead process troubleshooting and implement robust corrective/preventive actions to avoid recurrence of quality issues.

  • Spearhead cost reduction activities through material utilization improvement, automation, cycle time reduction, and process optimization.

  • Champion process capability improvements, ensure CPK/SPC monitoring, and maintain process stability.

  • Support customer audits and take ownership in audit preparation, response, and closure of findings related to the molding process.

  • Define and update SOPs, BKM (Best Known Methods), PFMEA, Control Plans, and Work Instructions to ensure process documentation integrity and compliance.

  • Drive automation and digital transformation in molding processes—such as auto mold vision inspection, predictive maintenance triggers, and reduction of human dependency.

  • Support NPI (New Product Introduction) builds, including tool qualifications, molding parameter development, and data gathering for engineering evaluations.

  • Provide process knowledge sharing and training to technicians and operators to uplift line performance and minimize process variation.

  • Coordinate with global teams to benchmark molding process technologies and deploy global best practices.

Education:

  • Bachelor’s degree in Mechanical, Materials, Electronics Engineering or a related field.

Experience & Skill:

  • Minimum of 3 to 5 years of working experience and, preferably in Transfer Molding /EOL processes of Semiconductor packaging.

  • Hands-on experience with transfer molding machines, mold tools, and associated metrology systems.

  • Strong analytical and statistical skills (SPC, Minitab, JMP, etc.).

  • Familiarity with EOL process flow and interdependencies between molding, PMC, laser marking, singulation and final test.

  • Proven experience in process optimization, problem-solving, and cross-functional collaboration.

Skills

  • Transfer molding
  • SPC
  • DOE
  • 8D Problem Solving
  • PFMEA
  • Process Optimization
  • NPI

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