Senior Staff ASIC Design Engineer
- XPENG
- Kuala Lumpur, Malaysia
- MYR 180,000 – MYR 260,000
Kuala LumpurFull-timeProduction / Manufacturing / Processing
Responsibilities
Responsibilities 1.ISP Module / Sub-System Ownership:Own the micro-architecture and RTL of key ISP blocks or sub-systems end-to-end, from spec definition through tape-out and mass production. 2.Architecture & PPA Leadership:Drive pipeline-level dataflow, buffering strategy and interface design; lead PPA trade-offs across image quality, area, bandwidth and power; deliver architecture and μArch specifications. 3.Cross-Team Collaboration:Partner deeply with algorithm, tuning, SW / driver, DV and backend teams; align on reference-model strategy, register interfaces and convergence plans. 4.Silicon Bring-up & Productization:Lead silicon-stage image-quality debug, root-cause analysis and RTL ECOs; ensure smooth ramp to mass production. 5.Technical Leadership:Mentor mid-level and junior engineers; drive design methodology, code quality, low-power (UPF), CDC / RDC and documentation standards across the team.
Qualifications
Requirements Basic 1.BS or above in Microelectronics / EE / Communications / CS or related field. 2.5+ years of digital IC front-end experience, with at least one taped-out chip containing ISP as a key contributor or module owner. 3.Strong proficiency in Verilog / SystemVerilog and SVA. 4.Proficient with mainstream EDA tools; familiar with JasperGold / VC Formal. Solid experience with AMBA protocols and high-bandwidth DMA design. 5.Deep understanding of the full camera imaging pipeline; able to articulate the physical meaning, image-quality impact and hardware implementation of each stage. 6.In-depth knowledge of mainstream CFA patterns and their hardware implications. 7.Strong engineering intuition for ISP bandwidth, line-buffer area and power budgets. 8.Proven ability to drive technical discussions with algorithm engineers on precision, approximation and hardware-friendliness. Nice to Have 1.Hands-on experience with AI-ISP HW/SW co-design. 2.Experience with multi-camera fusion, bokeh, super-resolution or similar advanced imaging features. 3.Automotive ISP experience. 4.Familiarity with MIPI CSI-2 and a broad range of sensor RAW characteristics. 5.Track record of leading a module from spec to sign-off. 6.Experience with commercial ISP IP or in-house ISP development.
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Skills
- Verilog
- SystemVerilog
- SVA
- ISP micro-architecture
- PPA Optimization
- UPF low power design
- JasperGold / VC Formal




