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Staff Process Engineer (Plasma)

  • ams OSRAM
  • Kulim, Malaysia
  • MYR 120,000 – MYR 160,000

Sense the power of light

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on https://ams-osram.com

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Your new responsibilities

  • Primary owner for plasma etching processes(GaN/SiO2/SiN/ALD film) in ICP chambers .
  • Carry out improvement activities related to plasma etching topic (cycle time improvement, CPk improvement, scrap reduction, etag reduction, troughput improvement, cost reduction, new tool start-up and etc).
  • Analyze root causes for any process deviations, defects, and yield losses topics related to plasma processes/tools.
  • Providing resolution(corrective/preventive action plan) to process issues related to plasma etching.
  • Monitor SPC chart and provide improvement plan to ensure Cpk > 1.67
  • Maintain and update Standard Operating Procedures (SOPs), process specification, Out of Control Plan(OCAP), FMEA and ECP documents.
  • Attend MRB for non-coformance lot disposition and follow up on 8D topic.

What we look for

  • Candidate must have at least a Bachelor's Degree or above in Engineering.
  • Min 3 years of experience in wafer fabrication specialized in dry plasma etching. Experience in PeCVD is an added advantage.
  • Technical knowledge in the area of electronics and/or semiconductor wafer fabrication.
  • Knowledge of problem solving skill, 6Sigma DMAIC approach.
  • Skilled in SPC/8D/6Sigma/DOE and Literate in statistic software such as JMP/Minitab/Corenerstone.
  • Good communication skill in English and Bahasa Malaysia.

Please contact Muhammad Hafizuddin Mohamed Anuar for further information via Hafizuddin.Anuar@ams-osram.com.

Skills

  • Plasma Etching
  • ICP (Inductively Coupled Plasma)
  • Statistical Process Control (SPC)
  • Root Cause Analysis
  • Process Optimization
  • Thin Film Processes
  • Semiconductor Manufacturing

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